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LTM8025
ABSOLUTE MAXIMUM RATINGS
(Note 1)
V IN , RUN/SS Voltage .................................................36V
ADJ, RT, SHARE Voltage .............................................6V
V OUT , AUX .................................................................25V
PGOOD, SYNC...........................................................30V
PIN CONFIGURATION
BIAS ..........................................................................25V
V IN + BIAS .................................................................56V
Maximum Junction Temperature (Note 2) ............ 125°C
Solder Temperature............................................... 245°C
1
2
3
4
5
6
7
1
2 3
4
5
6 7
BANK 1
A
B
C
V OUT
GND
BANK 1
A
B
C
V OUT
GND
D
E
D
E
BANK 2
F
G
RT
BANK 2
F
G
RT
H
J
AUX
BIAS
SHARE
PGOOD
H
J
AUX
BIAS
SHARE
PGOOD
BANK 3
K
L
V IN
RUN/SS SYNC
ADJ
BANK 3
K
L
V IN
RUN/SS SYNC
ADJ
LGA PACKAGE
70-PIN (9mm × 15mm × 4.32mm)
T JMAX = 125°C, θ JA = 24.4°C/W, θ JC(BOTTOM) = 11.5°C/W,
θ JC(TOP) = 42.7°C/W, θ JB = 18.7°C/W
θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER
WEIGHT = 1.8 GRAMS
ORDER INFORMATION
BGA PACKAGE
70-PIN (9mm × 15mm × 4.92mm)
T JMAX = 125°C, θ JA = 24.4°C/W, θ JC(BOTTOM) = 11.5°C/W,
θ JC(TOP) = 42.7°C/W, θ JB = 18.7°C/W
θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER
WEIGHT = 1.8 GRAMS
PART NUMBER
PAD OR BALL FINISH
PART MARKING*
DEVICE FINISH CODE
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(Note 2)
LTM8025EV#PBF
LTM8025IV#PBF
LTM8025MPV#PBF
LTM8025EY#PBF
LTM8025IY#PBF
LTM8025IY
LTM8025MPY#PBF
LTM8025MPY
Au (RoHS)
Au (RoHS)
Au (RoHS)
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
SAC305 (RoHS)
SnPb (63/37)
LTM8025V
LTM8025V
LTM8025MPV
LTM8025Y
LTM8025Y
LTM8025Y
LTM8025Y
LTM8025Y
e4
e4
e4
e1
e1
e0
e1
e0
LGA
LGA
LGA
BGA
BGA
BGA
BGA
BGA
3
3
3
3
3
3
3
3
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
? Terminal Finish Part Marking:
www.linear.com/leadfree
? Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
? LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
8025fc
2
For more information www.linear.com/LTM8025
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